World Stamp Expo 89, Abraham Lincoln 1869 Stamp Design, First Issue USA

United States Commemorative Postage Stamp, World Stamp Expo 89, Abraham Lincoln 1869 Stamp Design,

Issued March 16, 1989, New York, New York,

First Day of Issue Cover, FDC, Fleetwood Cachet, Unaddressed,

Cover in Removable Transparent Poly Sleeve and Mailed With Protection,

Made in the USA.

Genuine First Day of Stamp Issued Cover Cancelled on the First Day of Issue Date by the U.S. Postal Service,