$7.65
On Hold
0.25mm BGA Clip Ball IC Solder Steel Arrangement Template Cell Phone Repair Tool
More than 10 available
Details
Shipping: Australia: free (more destinations)
Condition: Brand new
*The store has not been updated recently. You may want to contact the merchant to confirm the availability of the product.
Description:
* This is a Cell Phone Repair Tool for professional
* This BGA Arrangement Template used for solder BGA clip balls/ Cell phone IC/ Cell phone CPU
* Made of high quality stainless steel sheet materials
* The small grids are molded by laser, durable and not easy to distort when be heated
* This BGA Clip Ball Solder Template contains many types of cell phone’s BGA clip ball template, such as Motorola V3/V3i flash, Motorola V3x flash, Siements C55 flash, Nokia 7650 MF, Motorola V66 flash, Samsung V208 IC, Nokia 3510 CPU, Nokia 8810 CPU, ect
* This IC Solder Template will help you to save your material in the repair process
* Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
* Thickness: 0.25mm
* Total size: about 245 x 95 x 0.25mm (L x W x H)
* Weight: 28g
* This is a Cell Phone Repair Tool for professional
* This BGA Arrangement Template used for solder BGA clip balls/ Cell phone IC/ Cell phone CPU
* Made of high quality stainless steel sheet materials
* The small grids are molded by laser, durable and not easy to distort when be heated
* This BGA Clip Ball Solder Template contains many types of cell phone’s BGA clip ball template, such as Motorola V3/V3i flash, Motorola V3x flash, Siements C55 flash, Nokia 7650 MF, Motorola V66 flash, Samsung V208 IC, Nokia 3510 CPU, Nokia 8810 CPU, ect
* This IC Solder Template will help you to save your material in the repair process
* Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
* Thickness: 0.25mm
* Total size: about 245 x 95 x 0.25mm (L x W x H)
* Weight: 28g
HK, hongkong
