$35.69
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MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer
4 available
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Shipping: Australia: free (more destinations)
Condition: Brand new
Returns: 7 days, buyer pays return shipping (more)
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MECHANIC 3D BGA Reballing Stencil Kit for iPhone X Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net --Adopting high-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. --It's easy to scrape tin,and the thickness of steel sheet around the work can reach 0.3mm,high strength, not easy to deform when pressed by hand. --Positioning slot is made of high temperature resistant synthetic stone. --Small and portable,it can be magnified under a microscope Package: 1* 3D BGA Reballing Stencils
CN, MT
